The 2021 Okamoto SPP800ATB is a fully automatic wafer polisher designed for precision polishing in semiconductor manufacturing. Manufactured in Japan by Okamoto, this model supports simultaneous polishing of 4-6 inch wafers (4 inch x 8 wafers or 6 inch x 4 wafers per cycle) using a waxless design with 3 polishing heads and 2 platens. It features a loading unit with 4 cassette ports (dry in), wafer handling robot, polish heads with 120-degree index and vacuum clamping, φ820mm polish tables with oscillation, un-loading unit with wet out, brush-type pad conditioner, and enclosed cover with safety interlocks. The machine is nearly brand new, having been installed and tested but never put into production, making it ideal for high-precision wafer processing in semiconductor applications.

Specifications:

• Machine Type: Fully Automatic Wafer Polisher
• Manufacturer: Okamoto
• Model: SPP800ATB
• Manufacture Year: 2021
• Origin: Japan
• Wafer Size: 4-6 inch (4 inch x 8 or 6 inch x 4 per cycle)
• Polish Tables: 2 x φ820mm, 10-114 RPM, ±25mm oscillation
• Chuck Tables: 3 x φ390mm, 5-100 RPM, 900kg max pressure
• Dimensions: W2680 x D2770 x H2451 mm
• Weight: 9500 kg
• Power: AC200V 3ph, 100A breaker
• Air: 100L/min >0.55MPa
• DI Water: 5L/min average, 33L/min max
• Exhaust: 3m³/min
• City Water: 2L/min for vacuum pump
• Environment: 23±1°C, 50±10% humidity, 10-40 dB vibration
• Condition: Nearly new (installed and tested, no production use)
• Location: Taiwan

Applications:

• Wafer polishing in semiconductor production
• Precision surface finishing for electronics
• Research and small-scale engineering polishing