Scribing-dicing is a precision cutting technique used in a variety of industries, including electronics, materials science, and microfabrication. It involves the creation of fine grooves or trenches in a material, typically a thin substrate or wafer, which can then be cleanly separated or diced into smaller pieces.
Scribing-dicing is a precision cutting technique used in a variety of industries, including electronics, materials science, and microfabrication. It involves the creation of fine grooves or trenches in a material, typically a thin substrate or wafer, which can then be cleanly separated or diced into smaller pieces.
Scribing-dicing is a precision cutting technique used in a variety of industries, including electronics, materials science, and microfabrication. It involves the creation of fine grooves or trenches in a material, typically a thin substrate or wafer, which can then be cleanly separated or diced into smaller pieces.
